Type:
Specification:
[ Machine Function ]
Used in testing the solar module Crack,breakage,Black Spot,Mixed Wafers,Process Defect,Cold Solder Joint phenomenon
[ Technical Specification ]
Item |
OEL-F1600 |
|
Camera Specification |
Camero: Nikon Image sensor: CMOS Pixel:1620W Resolution: 4928*3264 Image sensor size: |
23.6mm*15.6mm Pixel Size :4.76um*4.76um Shooting download time : 1500ms |
Run Mode: |
online |
|
Monitor Point: |
Before or After Laminating |
|
Sample Size: |
≤2150mm*1150mm |
|
Operation Height: |
950mm |
|
Resolution: |
1600W |
|
Test Scope |
Test Size 2150X1150mm Voltage:46—48V Current:7—8A Test environment temperature:-20℃—40℃ |
|
Exposure Time: |
1 ~ 60s |
|
Test parameter |
Target、Gain、Time、Gamma、Contrast、Data wide |
|
Current/Voltage: |
10A/60V |
|
Loading system: |
Using for transporting module Module will be located on this station |
|
EL Test system |
Reflection |
|
Unloading system |
For transfer of module after test. |
|
Software: |
1.Interface for barcode scanning, naming files with barcode names; |
|
Detection Ability: |
Crack,Black Spot,Mixed Wafers,Process Defect,Cold Solder Joint. |
|
Configuration |
Testing host, loading, unloading system,computer, software |
|
Machine Size: |
3300*1900*1250mm |
[ Machine Advantage ]
Reveals invisible defects such as microcracks, breakage,finger defects, and dark areas
Improves line yield by identifying defective modules before lamination
Improves quality and reliability of final product
Highest available resolution
Flexible system can be used to test framed or unframed modules, before or after lamination
[ Judging defect classification ]
Welding spots |
Crack |
Current not match |
Cell Process defect |
Virtual welding |
Cell contaminate |
OK |
OK |
OK |
OK |
OK |
OK |
Building 1, Zixin Industrial Park, Yangguang Ave,Jiangxia Economic Development Zone, Wuhan of China
Mon-Fri: 8.30AM-5.30PM (UTC+8)